REFINED FUSION, VISIBLE HONESTY

EB-177 is a low viscosity, high Tg, two part epoxy that can be used for potting, encapsulating, or bonding. It is used highly in the medical, optical, and semiconductor industries.

EB-177 has excellent high temperature resistance at 300°C and excellent solvent, chemical, and moisture resistance including gamma rays, autoclave, and ETO. It is an excellent choice for semiconductor applications including capillary underfill or flip chip die attach. USP Class VI Certified for Biocompatibility

EB-117是一款低粘度、高TG、双组分环氧胶，被用于灌封、浇铸、粘接；在医疗、光学和半导体领域广泛应用。

EB-117拥有优良的耐高温性能达300°、耐溶剂、耐化学、耐潮汽性能，包括耐伽马射线辐照灭菌、高压灭菌 和 ETO环氧乙烷灭菌。在半导体领域应用中被优选，包括倒装芯片中的毛吸底部填充。符合UPS六级生物医疗认证。