REFINED FUSION, VISIBLE HONESTY

EB-403-1LV-T1 is a single component, thermally conductive, electrically insulating, epoxy adhesive for semiconductor, hybrid IC, and electronic circuit assembly applications. It is a thixotropic paste and a non-sagging adhesive and easy to dispense. It is also useful for deposition methods like dispensing, printing, or hand held processes. 
Suggested Applications:
Hybrid: Staking SMDs onto the PCB for extra mechanical support; insulation layer between 2 contact pads of caps and resistors.  Heat sinking devices on ceramic PCB and PCB to external case; adhesion to Si, Au, kovar, Al-N, BT . Reinforcing and extra mechanical support for wire bond integrity.
Electronics:  Bonding passive devices such as inductor coils, ferrites, motors, connectors, and various SMDs
Adhesion to FR4 and common PCB substrates and housings 

EB-403-1LV-T1是一种用于半导体、混合IC和电子电路组装应用的单组分、导热绝缘环氧胶。它是一种触变膏状和不流挂胶体，适合针筒点胶。它也适用于分配、丝印或手动施胶。
建议应用：

装配：将SMD固定在PCB上，以获得额外的机械支撑；2层接触垫与电阻器之间的绝缘层。

陶瓷PCB上的散热装置和PCB至外壳;粘接硅材、金、可伐合金、氮化铝、钛合金。
金线补强.
电器：

粘接导体线圈、磁铁、电机、连接器和各种SMD无源器件。

粘接FR4、通用PCB版和壳体。