EO-24 is a two components, 100% solids
silver-filled epoxy system designed specifically for chip bonding in
microelectronic and optoelectronic applications. It is used for thermal
management applications due to its high thermal conductivity. It is used for
opto-electronic packaging material - LED, LCDs, and fiber optic components.
EO-24 is suggested for plastic IC packaging, high power devices and high
current flow, High power LEDs. It is also recommended for use in high speed
epoxy chip bonding. EO-24 is easy to apply by dispensing, screen printing,
die-stamping, or by hand
EO-24是一种双组分、100%固化体系银填料环氧胶黏剂，专为微电子和光电子应用中的芯片粘接而设计。由于其高导热性，因此用于热管理应用。它用于光电封装材料——LED、LCD和光纤元件。EO-24建议用于塑料IC封装、大功率器件和大电流、大功率LED。也建议用于高速芯片贴装。EO-24易于通过自动针筒点胶、丝网印刷、模压或手工施胶应用。
