EPOXIOHM-23M is two parts, low viscosity,
silver filled, and high electrical conductivity epoxy adhesive. It is designed
to cure at room temperature or rapidly at elevated temperature and exhibits
very excellent adhesion and bond strength to a wide variety of substrates. It
can also be used for EMI/RFI shielding applications.
EPOXIHM-23M是由两部分组成的低粘度、银填料和高导电性环氧胶粘剂。其设计可在室温下固化或在高温下快速固化，并对各种基材表现出非常优异的粘接能力和粘接强度。它也可用于EMI/RFI屏蔽应用。
