EO-21M-5 is an electrically conductive
& thermally conductive, silver filled epoxy adhesive. This two component
system is designed to be cured at room temperature or the cure can be
accelerated by elevated temperatures. The system is a 100% solids epoxy system,
contains no solvents.
Features & Applications : This smooth, flowing paste has a 3-4 hours working life which
enables the user to apply this material by dispensing, printing or by hand. The versatility in application methods allows its use in a wide variety of
applications. Exhibits superior adhesion to a wide variety of substrates
including most metals, ceramics, glass and plastics. This material is well
suited for use in electronic component and die attach, substrate attach and EMI
shielding applications. It is also widely used in low temperature and cryogenic
applications
EO-21M-5是一种导电&导热、银填料环氧胶粘剂。该双组分系统设计为在室温下固化，或可通过高温加速固化。该体系为100%固化环氧树脂体系，不含溶剂。
特性与应用：
这种光滑、流动的膏体有3-4小时的操作时间，户可以通过自动针筒点胶、丝印或手动使用这种材料。应用方法的多功能性允许其在各种应用中使用。
对多种基材具有优异的粘接能力，包括大多数金属、陶瓷、玻璃和塑料。该材料非常适合用于电子元件和芯片连接、基板连接和EMI屏蔽应用。它还广泛用于低温和极低温应用场景。
