EO-30-FST is two part, fast cure, silver
filled, and high electrical conductivity epoxy adhesive. Both components are
silver filled permitting a simple 1:1 mix ratio by weight. It has smooth creamy
consistency. It can cure in 4 to 8 hours at room temperature. Typical
applications are lead terminations, bonding ferrites, circuits & conductive
bonds on surface which will not tolerate the elevated temperatures required for
fired-on coating or solders.
EO-30-FST是双组分、快速固化、银填料和高导电性环氧胶粘剂。两种成分均为银填料,允许按重量计算的简单1:1混合比。它有光滑的奶油状膏体。在室温下可在4至8小时内固化。典型应用是引线端接、粘结铁氧体、电路和表面上的导电粘接,这些应用将无法承受涂层或焊料、烧制所需的高温。