REFINED FUSION, VISIBLE HONESTY

Features & Suggested Application: ¾ USP Class VI Certified for Biocompatibility ¾ Ease of use: potting and casting, encapsulation and adhesive.
Semiconductor applications: flip chips underfill, glob top encapsulation over wire bonds, spin coating at wafer level including wafer level packaging. 
Fiber optic adhesive: bundling fibers, terminating fiber into ferrule, adhesive for mounting optics inside fiber components, bonding glass cover slip over V-groove; spectral transmission of visible and IR light.  Meets USP Class VI biocompatibility standards for medical devices and implantation applications 。 Adhesion to glass, quartz, metals, wood and most plastics is very good 

特点和应用：

USP六级生物相容性认证

易用性：灌封和浇筑、封装和粘合剂。

半导体应用：倒装芯片底部填充、线键上的球顶封装、晶圆级旋转涂层，包括晶圆级封装。光纤粘合剂：捆扎光纤、将光纤端接至套管、将光纤安装在光纤组件内的粘合剂、将玻璃盖滑过V型槽的粘合剂；可见光和红外光的光谱透射。

符合USP医疗器械和植入应用的六级生物相容性标准。

对玻璃、石英、金属、木材和大多数塑料的粘接力非常好。