EO-38M-3 is a two components, 100% solids
silver-filled epoxy system designed specifically for chip bonding in
microelectronic and optoelectronic applications. It is used for thermal
management applications due to its high thermal conductivity. Features: • Used
for opto-electronic packaging material - LED, LCDs, and fiber optic components
• Suggested for plastic IC packaging, high power devices and high current flow,
High power LEDs • Recommended for use in high speed epoxy chip bonding - Fast
cure • Ease of use - apply by dispensing, screen printing, die-stamping, or by
hand.
EO-38M-3是一种双组分、100%固化体系银填料环氧胶,专为微电子和光电子应用中的芯片粘接而设计。由于其高导热性,因此用于热管理应用。特点:•用于光电封装材料-LED、LCD和光纤组件 •建议用于塑料IC封装、大功率器件和大电流、大功率LED •建议用于高速环氧树脂芯片粘接-快速固化 •易于使用-通过自动针筒点胶、丝网印刷、针头移胶或手工施胶应用。