EO-83M-2 is one part, silver filled, high
electrical conductivity, epoxy adhesive for die attach, semiconductor and other
microelectronics applications. EO-83M-2 is designed for bonding a variety of
bare semiconductor devices to a lead frame or substrate. It may also be
suitable as a solder replacement or other applications requiring a snap cure,
electrically conductive adhesive.
EO-83M-2是一种单组分、银填充、高导电性的环氧胶粘剂，用于芯片连接、半导体和其他微电子应用。EO-83M-2设计用于将各种裸半导体器件连接到引线框架或基板上。它也可以用作焊料替代品或其他需要快速固化导电胶粘剂的应用。
