产品描述
EB-112LV-2
is a two components - optical, medical, and semiconductor grade epoxy resin,
with low viscosity, long pot-life, and good handling characteristics.
Features & Suggested Application: Suggested for LCD optical lamination and sealing of glass plates.
Ease of use: potting and casting, encapsulation and adhesive.
Semiconductor applications: flip chips underfill, glob top encapsulation over wire bonds, spin coating at wafer level
including wafer level packaging.
Fiber optic adhesive: bundling fibers, terminating fiber into ferrule, adhesive for mounting optics inside fiber
components, bonding glass cover slip over V-groove; spectral transmission of visible and IR light.
Meets USP Class VI biocompatibility standards for medical devices and implantation applications
¾ Adhesion to glass, quartz, metals, wood and most plastics is very good