REFINED FUSION, VISIBLE HONESTY

Features & Applications:
 Semiconductor: Wafer to wafer bonding; MEMs devices; flip chip underfill 
Hybrid: fiber optic, hermetic seals and high temperature packaging sensors
Fiber optic: Sealing fiber into ferrules, transmitting light in the optical pathway, Fiber component packaging; adhesive for active alignment of optics, environmental seal of opto-package, V-groove arrays
Medical: Potting fiber optic bundles into ferrules for light guides and endoscopes; Capable of resisting several sterilization techniques; Certified USP Class VI for Biocompatibility Standards; adhesive for catheter devices
Electronics Assembly: Used as dielectric layer in the fabrication of capacitors; laminating PZT ferroelectrics; Impregnating windings in motors and inductor coils; Bonding ferrite cores and magnets; Structural adhesive for electronic components 。

半导体：晶元粘晶元；MEMs器件；芯片倒装底部填充。
混装：光纤， 传感器的高温气密封装。

光纤： 光纤套管密封，光路传输，光纤束装配，光耦合粘接，V型槽光纤阵列。

医疗：内窥镜的光纤导管的光纤束灌封；耐受多种灭菌方式；美国药典第六级生物相容性标准认证；医用导管粘接。

电子装配：被用作电容器制造中的介电层；压电陶瓷堆叠粘接；电动机和感应线圈的浸渍绕组；铁氧体磁芯和磁体的粘接；电子组装结构粘接。

无填料EP-119SP ，低粘度、热固型、耐高温环氧胶。被推荐使用在210°高温还有高拉伸强度，优秀的耐高温、耐化学性。特别是在高温下，应用于具有高绝缘电阻的薄层粘接、涂层、密封。推荐用于粘接金属、玻璃、陶瓷基材。具有长的粘度变化时间、固化后成琥珀色。